It is a kind of packaging technology. It is a technology tosolve the problem of LED lamp protection. It uses an advanced new transparent material to package thesubstrate and its LED package unit to form effective protection.
This material not only has ultra-high transparency but alsohas superior thermal conductivity.
The GOB can be adapted to any harsh environment with a smallgap to achieve true moisture, water, dust, impact and UV resistance.
Compared with the traditional SMD, it is characterized byhigh protection, moisture-proof, waterproof, anti-collision, and anti-UV. Itcan be applied to more harsh environments and avoid large-scale deadlights andlights.
Compared with COB, it is characterized by simplermaintenance, lower maintenance cost, larger viewing angle, and 180-degreehorizontal viewing angle and vertical viewing angle.
The production steps of the GOB series new products areroughly divided into 3 steps:
1. Choose the best quality materials, lamp beads, industryultra-high brush IC solutions, high quality LED chips 2. After the product is assembled, aging for 72 hours beforeGOB filling, the lamp is tested 3. After the GOB is filled, it will be aged for another 24hours to confirm the product quality again.
